永乐高ylg8888|中国有限公司-官方网站

Stock Code:002962
CNEN
0716-88000025
Semiconductor Optical Products

Through - hole glass wafer

Technical Specifications
Spacer Product Size(大孔产品尺寸) 详情
Material(材料) D263T、BF33 等
Thickness(厚度) D263T:0.2mm ≤ T ≤ 1mm
BF33:0.2mm ≤ T ≤3mm
Size of hole(孔径范围) 当 T ≤1mm 时,最小 40 μm
Through - hole taper(通孔锥度) ≤ 0° - 2°
Aspect ratio(最大深宽比) 最大 20:1
Through - hole size tolerance (upper and lower surfaces)(通孔尺寸公差(上下表面)) ±10μm
Roundness(圆度) ≤ 15 μm
Chipping(崩边) 激光诱加工后无崩边,刻蚀后崩边 ≤ 10 μm
Position tolerance(位置度公差) 在 φ200mm 范围内 ± 10 μm
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